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Automated inspection algorithm for bump inspection! Inspection device for high-speed slope CT imaging.
【Features】 ■ Bump inspection using automatic inspection algorithms ■ High-speed inclined CT imaging ■ 60-degree angle and full surrounding field of view measurement ■ Open-type micro-focus tube, transmission tube For more details, please contact us or download the catalog.
We introduce a wire bonding X-ray inspection device capable of sorting and discharging based on defective content!
Our company is advancing the development of X-ray inspection equipment that meets the needs of various industries, primarily based on the image processing technology we have cultivated over many years. The "Wire Bonding X-ray Inspection Equipment" conducts inspections of the wire shapes inside the package after resin molding using X-ray images. It is capable of sorting and discharging based on the type of defect. 【Features】 ■ Capable of sorting and discharging based on the type of defect ■ Inspections of wire shapes, foreign objects, and voids *For more details, please refer to the related link page or feel free to contact us.
